噪声环境对弹上电子设备的作用机理研究

Study on Action Mechanism of Noise Environment on Missile-borne Electronic Equipments

关键词:  噪声环境  电子设备  作用机理

Key words:  Noise environment  Electronic equipment  Action mechanism

摘要:

建立了弹上电子设备声振耦合理论抽象模型，采用数值实验方法研究了电子设备周围环境的噪声载荷如何从外部传递到内部对其内部器件的作用机理。分析得出：环境声场的声波入射到电子设备壳体外表面时发生反射与透射，其中反射声压与入射声压合成后同时作用于壳体外表面；合成压力载荷通过两条途径对电子设备器件内部产生影响，一条是激发电子设备壳体结构振动，并通过壳体结构及其与内部结构的机械连接，带动内部结构振动；另外一条是激发电子设备腔内声空间响应，产生二次声压场，再由二次声压场激励壳体内部结构产生振动；透射声压主要集中在低频且量级较小，其作用远比前述两条途径微弱。

Abstract:

A vibro-acoustic coupled principle model is presented, and how the noise loads transfer from exterior of electronic equipments into interior and act on electronic components is researched by means of numerical experiments. Some conclusions obtained are those: the incidence acoustic wave arises reflection and refraction on the exterior surfaces of electronic equipments, and the synthesized acoustic pressure of incidence acoustic wave and reflection acoustic wave acts on them and makes effects on the interior electronic components by two ways, one is forcing the frame of electronic equipments to vibrate. then exciting the electronic components to vibrate via mechanism link, the other is exciting the interior sound field, then forcing the electronic components to vibrate. The less refraction acoustic pressure focuses mainly in lower frequency region, and the action is negligible.